Sells 3D IC development lab to Tezzaron; Novati Technologies to operate facility
RESEARCH TRIANGLE PARK, N.C., Dec. 9, 2013 Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, today announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D integration. As a key part of the agreement, Ziptronix sold its 3D IC development lab to Tezzaron, to be operated by Novati.
Due to widespread adoption of direct bonding in volume manufacturing, Ziptronix no longer has to dedicate its resources to supporting a lab for commercialization of its patented ZiBond® and DBI® technologies. Tezzaron will use the facility to support development and manufacturing of its rapidly growing advanced memory products. The deal includes a strategic agreement with Tezzaron that provides Ziptronix's lab customers continued access to the facility to perform their advanced development work.
ZiBond has been in high-volume manufacturing for several years now and DBI is well on its way into production," said Dan Donabedian, CEO of Ziptronix. "Quite simply, as the market is now convinced of the value of our technology, our needs have shifted. As we look to accelerate 3D integration, our focus is increasingly on addressing the needs of the maturing and emerging markets that are adopting our technology via licensing.
Ziptronix's ZiBond® technology is essential to the manufacture of the backside illumination (BSI) image sensors used in devices such as smartphones, tablets and digital cameras; applications for which it has seen wide-scale adoption in high-volume manufacturing. At the same time, the company's DBI® technology is rapidly maturing, with increasing adoption for advanced memory and integrated image sensor applications. Tezzaron and Novati have licensed Ziptronix technologies to strengthen their position in manufacturing semiconductor applications.
This is truly a 'win-win' for all parties involved," said Tom Ayers, CEO of Tezzaron."We get the facility we need for our technology development, fully equipped and staffed with seasoned personnel. At the same time, Ziptronix retains its ability to support its customers by ensuring they are able to continue their advanced development work in the lab.
A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® and DBI®technologies deliver the industry¹s most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property (IP) has been licensed for a variety of semiconductor applications including backside-illuminated (BSI) sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company holds more than 35 U.S. patents and more than 20 international patents, with more than 45 U.S. and international patent applications pending. For more information, visit www.ziptronix.com.
Tezzaron Semiconductor Corporation is a world leader in the design and production of 3D-ICs including high-performance memory and sensor arrays. Tezzaron's unique device architecture and assembly methodology allows unrivaled performance and unprecedented low power. Tezzaron is the world's only turnkey 2.5D and 3D SOC supplier offering both design and fabrication services. Corporate headquarters are located at 1415 Bond St., Suite 111, Naperville, Ill. 60563. For more information, visit http://www.tezzaron.com.
Novati Technologies, a wholly owned subsidiary of Tezzaron, is the premier innovation partner for accelerating nanotechnology development and commercialization. Novati's proven advanced technology and secure IP infrastructure, combined with its recognized Technology Development Process, supports companies developing MEMS, microfluidics, novel transistors, photovoltaics and other nanotechnologies for the semiconductor, life sciences and aerospace and defense markets. For more information, visit
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