Recent Events

Tharas Systems Appoints Carol Hallett as Vice President of North American Sales; Industry Veteran to Drive Sales of Hammer Family of Hardware-Based Verification Solutions Prior to Tharas she was at Phoenix Technologies, Mentor Graphics and Tera Systems in sales roles. She was the vice president of Sales for TransEDA and RoyoCAD. She began her career at National Semiconductors and Surface Mounted Technology in various technical and operational roles.

Other EDA News

Synopsys Appoints Brian Cabrera Vice President, General Counsel and Secretary

Magma's Kam Kittrell to Speak at FSA Semiconductor Forum

SynTest Receives a Patent for Debug, Diagnosis, and Yield Improvement of ICs Using Test Compression or Logic BIST

43rd Design Automation Conference Features Management Day Focused on Intersection of Business and Technology

Magma's John Lee on DFM Investing Panel at Canaccord Adams Conference

MOSAID Maestro Digital Frequency Synthesizer PLL Used in WiQuest Ultra-wideband IC

Synopsys' New DesignWare Bridge IP for PCI Express to AMBA 3 AXI Connects Two High-Performance Domains

Reminder - Accellera Announces Call for Nominations for Its Technical Excellence Award Honoring Contributions to Its Design Automation Standards Efforts

Globetech Solutions Joins Novas Harmony Program

43rd Design Automation Conference Features Leading-Edge Theme on Multimedia, Entertainment and Gaming

XtremeData Picks Altera's Stratix II FPGAs to Deliver Processor Acceleration for AMD(TM) Opteron Processor-Based Systems

Brion's LMC Put in 65nm Volume Production by Crolles2 Alliance

TI's New DaVinci™ Technology Development Kit Simplifies Design Effort for Next-Generation Video Applications

Tharas Systems Appoints Carol Hallett as Vice President of North American Sales

American Stock Exchange to Trade Options on Ansoft Corporation

VaST Announces the VaST World Partnership Program

AWR and CST Cooperate to Integrate 3D EM Software into Microwave Office Design Suite

Sandwork Spice Explorer and WaveView Analyzer 2006.1 Release Extends Support to Simulation Analysis, Hardware Measurement, and System-level Modeling

Novas Broadens Interoperability and Passes 50 Partner Milestone

AutoVue 19.1 Paves the Way for Seamless 2D to 3D Migration

Altera and MorethanIP Deliver First IEEE 1588 Protocol Solution for FPGAs

AWR and CST Cooperate to Integrate 3D EM Software into Microwave Office Design Suite

Rio Design Automation Expands RioMagic Support to Include Wire Bond, Flip Chip Designs

EVE Expands Hardware Verification Platform Family

EDA Consortium Elects Officers and Board Members

Other IP & SoC News

Airgo Networks Continues to Expand True MIMO(TM) Gen3 Product Line

WJ Communications Introduces High Dynamic Range, Variable Gain Amplifier for Mobile Infrastructure Applications

National Semiconductor Posts 23% Year-to-Year Revenue Growth, 61.4% Gross Margin and Earnings of 34 Cents Per Share for Fourth Quarter of Fiscal Year 2006

IPextreme to Speak at FSA Semiconductor Forum

NeoMagic(R) Corporation Reports Q1 Fiscal Year 2007 Results

TI Updates Second-Quarter 2006 Business Outlook

Tundra Semiconductor Releases Q4-Fiscal 2006 Financial Results and Announces Management Change

Xilinx Provides June Quarter FY07 Business Update

Peerless Systems Announces Fiscal First Quarter Results

Actel Corporation Announces Second Quarter Business Update

Dongbu Electronics Leads Worldwide Foundry Industry in Developing 130nm NOR Flash Memory Wafer Process

TI Introduces 2.25-MHz Dual-Output DC/DC Converters with Digital Control

NextIO and Denali Team to Enable First I/O Virtualization Designs for PCI Express

NEC Electronics America Expands PCI Express Single-Port ASSP Family With Very Small Form Factor Bridge

Renesas Technology to Introduce Single-chip SuperH Microcontrollers With USB2.0 Host, Audio and LCD Display Controller Functions for Car Digital Audio Products

O2IC Co., Ltd. Develops Novel Low Power 64Mb Memory Architecture Using Shared Bit-Lines Between Flash and SRAM

Innovasic Semiconductor to Provide Replacement ICs in Response to Intel's End of Life Notice

Innovative Silicon's Z-RAM Ultra Dense Memory IP Now Backed by 10th Patent

WJ Communications Introduces High Dynamic Range Mixers With Integral LO Amplifiers for Mobile Infrastructure Applications

NEC Electronics America Introduces New TFT-LCDs for Mobile Industrial Applications

Airgo Enables Unprecedented Mobile Wi-Fi Advantages

Vitesse Demonstrates Industry's First Gigabit Ethernet Wireless Broadband Gateway Solution for the SME and SOHO Markets

Inapac Technology and eSilicon Partner on SiP Program

SIA Raises Forecast for Chip Industry Growth

ON Semiconductor Introduces a Highly Efficient GreenPoint(TM) Reference Design for 60 Watt Power Adapters

Teridian Expands Power Meter IC Family

Motorola Announces India Manufacturing Facility

Avago Technologies Announces First Color Controller With Integrated RGB Photosensor for LCD Backlighting of Portable Display Devices

MOSAID Maestro Digital Frequency Synthesizer PLL Used in WiQuest Ultra-wideband IC

WJ Communications Introduces High Dynamic Range, Dual Channel Converter for Mobile Infrastructure Applications

Axiom Microdevices Introduces GSM/GPRS Quad-Band Power Amplifier Product

Industry Leaders to Chart the Future of Electronics Design and Development at 2006 Electronic Product Miniaturization Symposium

Micron Technology Targets Image Sensors at the Fast-Growing Webcam Market

Adventiq Launches New KVM-Over-IP System on a Chip

Sensor Termination Chip from STMicroelectronics Improves Performance of Automation Digital Inputs

UMC Reports Sales for May 2006

WJ Communications Introduces High Performance 28V InGaP HBT Power Amplifier Technology for Mobile Infrastructure Applications

NemeriX Releases High-Performance, Low Power Bluetooth Reference Design

Virage Logic Senior Executives Selected to Present at Key Industry Events

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